Mold flow assist processing (valve gate sequence control to reduce weld line & deflection)
Category:
Plastic Engineering Solutions
Price:
Discuss personally
Payment Method:
T/T, L/C,Western Union
Specifications
Quality-guaranteed:
Japanese Standard Of QC Management & Euramerican Standards
Introduction
DF mold use Moldflow to optimize the mold construction to reduce lead time & cost. we can set up the filling system and cooling system with in moldflow assistance!!
Mold flow Case Use In:
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Thermoplastic injection molding analysis types and technologies
The analysis technologies that are available to you depend on the analysis type that you select. This table lists the available analysis technologies for a given analysis type. -
Overmolding
Overmolding is an injection molding process where two materials are molded together. Types of overmolding include two shot sequential overmolding, multi-shot injection molding or insert overmolding. -
Gas-assisted Injection Molding
Gas-Assisted Injection Molding is a process where an inert gas is introduced at pressure, into the polymer melt stream at the end of the polymer injection phase. -
Co-injection analysis
Co-injection molding involves the injection of two different materials into the one mold. -
Injection-compression analysis
The Injection-compression molding process is an extension of conventional injection molding. After a pre-set amount of plastic melt is fed into an open cavity, it is compressed. The primary advantage of this process is the ability to produce dimensionally stable, relatively stress-free parts, at a low clamp force. Injection-compression molding is sometimes called coining, stamping, compressive-fill, or hybrid molding. -
Reactive Injection-compression Molding analysis types and analysis technologies
The following table shows the available analysis technologies for a Reactive Injection-compression Molding analysis type. -
Reactive Molding analysis types
Reactive Molding processes, also called thermoset molding processes, use thermoset materials. -
Microchip Encapsulation analysis
The Microchip Encapsulation analysis simulates the encapsulation of semiconductor chips with reactive resins, which provides protection from hostile environments, facilitates heat dissipation, and enables electrical interconnection of the chips. -
Microcellular Injection Molding analysis
A Microcellular Injection Molding analysis simulates the development of cells in the melt during injection molding. -
Resin Transfer Molding
Resin Transfer Molding (RTM) is a liquid composite molding process. -
Underfill Encapsulation analysis
The Underfill Encapsulation analysis is used to analyze the flow of the encapsulant material in the cavity, between the chip and the substrate during the underfill encapsulation process. -
Multiple-barrel Reactive Molding analysis types and analysis technologies
The following table shows the available analysis technologies for a Multiple-barrel Reactive Molding analysis type. - Valve gate sequence technique is used to control high precision injection hot runner molding. such as desrease the weld line on the cover surface, injection pressure to optimum can solve deformation Cause by nonuniform injection and temperature etc.
Details contact: Jacky Qiu Skype: df mold
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